DOI: 10.5937/jaes13-7210
This is an open access article distributed under the CC BY-NC-ND 4.0 terms and conditions.
Volume 13 article 312 pages: 45-50
A
wide range of epoxy resins are molded to produce composite components for
various applications. Release agents are generally used to facilitate the
removal of the component from the mold. The work presented in this paper shows
differences between release agents and resin during a RTM process. Adhesive
properties of release agents in interaction with the resin are analyzed, with
respect to pressure and temperature. It was found that the reaction of epoxy
resin results indifferent breakaway forces from mould surfacesdepending on used
agents.
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